Testing of Interposer-Based 2.5D Integrated Circuits
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1
Testing of Interposer-Based 2.5D Integrated Circuits (2017)
DE NWISBN: 9783319547138 bzw. 3319547135, in Deutsch, Springer-Verlag Gmbh Mrz 2017, neu.
Von Händler/Antiquariat, AHA-BUCH GmbH [51283250], Einbeck, Germany.
Neuware - This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. 182 pp. Englisch.
Neuware - This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. 182 pp. Englisch.
2
Testing of Interposer-Based 2.5D Integrated Circuits
DE HC NWISBN: 9783319547138 bzw. 3319547135, in Deutsch, Springer Shop, gebundenes Buch, neu.
Lieferung aus: Schweiz, Lagernd, zzgl. Versandkosten.
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. Hard cover.
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. Hard cover.
3
Testing of Interposer-Based 2.5D Integrated Circuits
DE NWISBN: 9783319547138 bzw. 3319547135, in Deutsch, neu.
Lieferung aus: Vereinigtes Königreich Großbritannien und Nordirland, Lieferzeit: 11 Tage.
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.
4
Testing of Interposer-Based 2.5D Integrated Circuits
DE HC NWISBN: 9783319547138 bzw. 3319547135, in Deutsch, Springer-Verlag Gmbh, gebundenes Buch, neu.
Lieferung aus: Deutschland, Versandkostenfrei.
Testing of Interposer-Based 2.5D Integrated Circuits: This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. Englisch, Buch.
Testing of Interposer-Based 2.5D Integrated Circuits: This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. Englisch, Buch.
5
Testing of Interposer-Based 2.5D Integrated Circuits (2017)
EN HC US FEISBN: 9783319547138 bzw. 3319547135, in Englisch, 182 Seiten, Springer, gebundenes Buch, gebraucht, Erstausgabe.
Neu ab: $70.48 (19 Angebote)
Gebraucht ab: $84.79 (7 Angebote)
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Lieferung aus: Vereinigte Staaten von Amerika, Usually ships in 1-2 business days, tatsächliche Versandkosten können abweichen.
Von Händler/Antiquariat, PBShop UK.
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable., Hardcover, Ausgabe: 1st ed. 2017, Label: Springer, Springer, Produktgruppe: Book, Publiziert: 2017-03-21, Studio: Springer, Verkaufsrang: 7562982.
Von Händler/Antiquariat, PBShop UK.
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable., Hardcover, Ausgabe: 1st ed. 2017, Label: Springer, Springer, Produktgruppe: Book, Publiziert: 2017-03-21, Studio: Springer, Verkaufsrang: 7562982.
6
Testing of Interposer-Based 2.5D Integrated Circuits (2017)
DE NWISBN: 9783319547138 bzw. 3319547135, in Deutsch, 182 Seiten, Springer-Verlag GmbH, neu.
Lieferung aus: Deutschland, Versandkosten nach: Schweiz.
Von Händler/Antiquariat, Rhein-Team Lörrach, [3332481].
Neuware - This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. -, 23.06.2017, Buch, Neuware, 241x148x20 mm, 449g, 182, Internationaler Versand, offene Rechnung (Vorkasse vorbehalten), PayPal, Banküberweisung.
Von Händler/Antiquariat, Rhein-Team Lörrach, [3332481].
Neuware - This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. -, 23.06.2017, Buch, Neuware, 241x148x20 mm, 449g, 182, Internationaler Versand, offene Rechnung (Vorkasse vorbehalten), PayPal, Banküberweisung.
7
Testing of Interposer-Based 2.5D Integrated Circuits
DE HC NWISBN: 9783319547138 bzw. 3319547135, in Deutsch, Springer International Publishing, gebundenes Buch, neu.
Lieferung aus: Vereinigte Staaten von Amerika, Lagernd, zzgl. Versandkosten.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
8
Testing of Interposer-Based 2.5D Integrated Circuits (2017)
DE HC NWISBN: 9783319547138 bzw. 3319547135, in Deutsch, gebundenes Buch, neu.
Lieferung aus: Deutschland, Next Day, Versandkostenfrei.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
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