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Aus dem Archiv:
9780080540269 - H. Fukuda: Rapid Thermal Processing for Future Semiconductor Devices - Buch

H. Fukuda (?):

Rapid Thermal Processing for Future Semiconductor Devices (2003) (?)

Lieferung erfolgt aus/von: NiederlandeBuch ist in englischer SpracheNeuware, neues BuchEBook, E-Book, elektronisches Buch
ISBN:

9780080540269 (?) bzw. 0080540260

, in Englisch, Elsevier Science, neu, E-Book
Direct beschikbaar
This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V com... This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V compound semiconductor devices. This book covers the following areas such as: advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe, hetero-structure, novel metallization, inter-connect, silicidation, low-k materials, thin dielectrics including gate dielectrics and high-k materials, thin film deposition including SiGe, SOI and SiC, process and device modelling, Laser-assisted crystallization and TFT device fabrication technologies, temperature monitoring and slip-free technologies. Productinformatie:Taal: Engels;Formaat: ePub met kopieerbeveiliging (DRM) van Adobe;Bestandsgrootte: 7.54 MB;Kopieerrechten: Het kopiëren van (delen van) de pagina's is niet toegestaan ;Printrechten: Het printen van de pagina's is niet toegestaan;Voorleesfunctie: De voorleesfunctie is uitgeschakeld;Geschikt voor: Alle e-readers te koop bij bol.com (of compatible met Adobe DRM). Telefoons/tablets met Google Android (1.6 of hoger) voorzien van bol.com boekenbol app. PC en Mac met Adobe reader software;ISBN10: 0080540260;ISBN13: 9780080540269; Engels | Ebook | 2003
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Kategorie: School en studie, Techniek en technologie, Elektronica /, School en studie, Exacte wetenschappen, Natuurkunde
Daten vom 09.06.2016 11:11h
ISBN (andere Schreibweisen): 0-08-054026-0, 978-0-08-054026-9
Aus dem Archiv:
9780080540269 - H. Fukuda: Rapid Thermal Processing for Future Semiconductor Devices - Buch

H. Fukuda (?):

Rapid Thermal Processing for Future Semiconductor Devices (?)

Lieferung erfolgt aus/von: DeutschlandBuch ist in deutscher SpracheNeuware, neues BuchEBook, E-Book, elektronisches Buch
ISBN:

9780080540269 (?) bzw. 0080540260

, in Deutsch, Pergamon; Pergamon Press, Vereinigte Staaten von Amerika, neu, E-Book
zzgl. Versandkosten, Sofort per Download lieferbar
Rapid Thermal Processing for Future Semiconductor Devices, This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V compound semiconductor devices.This book covers the following areas: advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe, hetero-structure, novel metallization, inter-connect, silicidation, low-k materials, thin dielectrics including gate dielectrics and high-k materials, thin film deposition including SiGe, SOI and SiC, process and device modelling, Laser-assisted crystallization and TFT device fabrication technologies, temperature monitoring and slip-free technologies.
Mehr…
Kategorie: eBooks / Fremdsprachige eBooks / Englische eBooks / Sach- & Fachthemen / Physik
Schlüsselwörter: eBooks
Daten vom 09.06.2016 11:11h
ISBN (andere Schreibweisen): 0-08-054026-0, 978-0-08-054026-9

9780080540269

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angelika stephan ulrich richter morales