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Reliability and Failure Analysis of Novel Lead-free Solders:
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9783330046474 - QuangBang Tao: Reliability and Failure Analysis of Novel Lead-free Solders
1
QuangBang Tao (?):

Reliability and Failure Analysis of Novel Lead-free Solders (?)

ISBN: 9783330046474 (?) bzw. 3330046473, in Deutsch, neu

Lieferzeit: 6 Tage
Von Händler/Antiquariat
Due to the RoHS and WEEE legislations for restricting the use of six hazardous materials in the manufacture of various types of electronic and electrical equipment, developing novel Pb-free solders becomes a real challenge for many industrials in recent years. Mechanical properties of the lead-free alloys are very important factors in the design and reliability evaluation of the soldered joints. Nowadays, among the newly-developed lead-free solder alloys, SAC-Bi,Ni,Sb (InnoLot) alloy, which contains minor quantities of Sb, Bi and Ni, have been identified as promising candidates for the automotive industry. In operation, the microstructure, mechanical response, and failure behaviour of the lead-free solder joints in the electronic assemblies are highly dependent on external factors such as the imposed thermal loads, the mechanical vibrations, the effect of aging, etc. Hence, it is essential to understand the reliability and failure of the novel lead-free solder in electronic packaging.
Bestellnummer des Händlers: 58cbbeb8e0db6009258b1f3b
Bestellnummer bei der Plattform Dodax.de: 28bf142d10c5659263bf2cb539038f 2f
Kategorie: Bücher / Naturwissenschaften, Medizin, Informatik & Technik / Technik / Maschinenbau
Daten vom 02.04.2017 02:07h
ISBN (andere Schreibweisen): 3-330-04647-3, 978-3-330-04647-4
9783330046474 - Tao, QuangBang: Reliability and Failure Analysis of Novel Lead-free Solders
2
Tao, QuangBang (?):

Reliability and Failure Analysis of Novel Lead-free Solders (?)

ISBN: 9783330046474 (?) bzw. 3330046473, in Deutsch, Lap Lambert Academic Publishing, gebundenes Buch, neu

Versandkostenfrei innerhalb von Deutschland
Von Händler/Antiquariat
Due to the RoHS and WEEE legislations for restricting the use of six hazardous materials in the manufacture of various types of electronic and electrical equipment, developing novel Pb-free solders becomes a real challenge for many industrials in recent years. Mechanical properties of the lead-free alloys are very important factors in the design and reliability evaluation of the soldered joints. Nowadays, among the newly-developed lead-free solder alloys, SAC-Bi,Ni,Sb (InnoLot) alloy, which Due to the RoHS and WEEE legislations for restricting the use of six hazardous materials in the manufacture of various types of electronic and electrical equipment, developing novel Pb-free solders becomes a real challenge for many industrials in recent years. Mechanical properties of the lead-free alloys are very important factors in the design and reliability evaluation of the soldered joints. Nowadays, among the newly-developed lead-free solder alloys, SAC-Bi,Ni,Sb (InnoLot) alloy, which contains minor quantities of Sb, Bi and Ni, have been identified as promising candidates for the automotive industry. In operation, the microstructure, mechanical response, and failure behaviour of the lead-free solder joints in the electronic assemblies are highly dependent on external factors such as the imposed thermal loads, the mechanical vibrations, the effect of aging, etc. Hence, it is essential to understand the reliability and failure of the novel lead-free solder in electronic packaging. Lieferzeit 1-2 Werktage
Bestellnummer des Händlers: 47800697
Bestellnummer bei der Plattform Buecher.de: 735660603
Kategorie: Buch > Mathematik, Naturwissenschaft & Technik > Technik > Maschinenbau & Fertigungstechnik
Daten vom 02.04.2017 02:07h
ISBN (andere Schreibweisen): 3-330-04647-3, 978-3-330-04647-4
9783330046474 - QuangBang Tao: Reliability and Failure Analysis of Novel Lead-free Solders
3
QuangBang Tao (?):

Reliability and Failure Analysis of Novel Lead-free Solders (2017) (?)

ISBN: 9783330046474 (?) bzw. 3330046473, in Deutsch, LAP Lambert Academic Publishing Mrz 2017, Taschenbuch, neu

Versandkostenfrei
Von Händler/Antiquariat, AHA-BUCH GmbH [51283250], Einbeck, Germany
Neuware - Due to the RoHS and WEEE legislations for restricting the use of six hazardous materials in the manufacture of various types of electronic and electrical equipment, developing novel Pb-free solders becomes a real challenge for many industrials in recent years. Mechanical properties of the lead-free alloys are very important factors in the design and reliability evaluation of the soldered joints. Nowadays, among the newly-developed lead-free solder alloys, SAC-Bi,Ni,Sb (InnoLot) alloy, which contains minor quantities of Sb, Bi and Ni, have been identified as promising candidates for the automotive industry. In operation, the microstructure, mechanical response, and failure behaviour of the lead-free solder joints in the electronic assemblies are highly dependent on external factors such as the imposed thermal loads, the mechanical vibrations, the effect of aging, etc. Hence, it is essential to understand the reliability and failure of the novel lead-free solder in electronic packaging. 144 pp. Englisch
Kommentar des Händlers/Antiquariats AHA-BUCH GmbH [51283250], Einbeck, Germany:
Händlerbewertung: 5, NEW BOOK, New
Bestellnummer bei der Plattform Abebooks.de: 22186906848
Daten vom 02.04.2017 02:07h
ISBN (andere Schreibweisen): 3-330-04647-3, 978-3-330-04647-4
9783330046474 - QuangBang Tao: Reliability and Failure Analysis of Novel Lead-free Solders
4
QuangBang Tao (?):

Reliability and Failure Analysis of Novel Lead-free Solders (2017) (?)

ISBN: 9783330046474 (?) bzw. 3330046473, in Deutsch, LAP Lambert Academic Publishing Mrz 2017, Taschenbuch, neu

Versandkostenfrei
Von Händler/Antiquariat, Agrios-Buch [57449362], Bergisch Gladbach, Germany
Neuware - Due to the RoHS and WEEE legislations for restricting the use of six hazardous materials in the manufacture of various types of electronic and electrical equipment, developing novel Pb-free solders becomes a real challenge for many industrials in recent years. Mechanical properties of the lead-free alloys are very important factors in the design and reliability evaluation of the soldered joints. Nowadays, among the newly-developed lead-free solder alloys, SAC-Bi,Ni,Sb (InnoLot) alloy, which contains minor quantities of Sb, Bi and Ni, have been identified as promising candidates for the automotive industry. In operation, the microstructure, mechanical response, and failure behaviour of the lead-free solder joints in the electronic assemblies are highly dependent on external factors such as the imposed thermal loads, the mechanical vibrations, the effect of aging, etc. Hence, it is essential to understand the reliability and failure of the novel lead-free solder in electronic packaging. 144 pp. Englisch
Kommentar des Händlers/Antiquariats Agrios-Buch [57449362], Bergisch Gladbach, Germany:
Händlerbewertung: 5, NEW BOOK, New
Bestellnummer bei der Plattform Abebooks.de: 22186911655
Daten vom 02.04.2017 02:07h
ISBN (andere Schreibweisen): 3-330-04647-3, 978-3-330-04647-4
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