Micromanufacturing Nanotechnology: Fundamentals, Techniques Platforms: Fundamentals, Techniques, Platforms, Experiments
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Von Händler/Antiquariat, Petra Gros Versandantiquariat, 56068 Koblenz.
Gebundene Ausgabe; neuwertig; XXIII, 468 Seiten : Ill., graph. Darst. , 24 cm Gebundene Ausgabe Buch ist absolut neuwertig; nur 1x durchgebl.

Von Händler/Antiquariat, Petra Gros [1048006], Koblenz, Germany.
XXIII, 468 Seiten : Ill., graph. Darst. , 24 cm Buch ist absolut neuwertig; nur 1x durchgeblättert und nachgelesen; N. P. Mahalik (Ed.) Micromanufacturing and Nanotechnology With 300 Figures SpringerContents 1 Introduction 1 1. I Background 1 1.2 Introduction 2 1.2.1 Precision Engineering 2 1.2.2 Micromilling and Microdrilling 3 1.3 Microelectromechanical Systems (MEMS) 5 1.3.1 An Example: Microphenomenon in Electrophotography 6 1.4 Microelectronics Fabrication Methods 7 1.4.1 Bulk Micromachining 8 1.4.2 Surface Micromachining 8 1.5 Microinstrumentation 9 1.6 Micromechatronics 9 1.7 Nanofinishing 10 1.8 Optically Variable Device 10 1.9 MECS 11 1.10 Space Micropropulsion 11 1.11 e-beam Nanolithography 12 1.12 Nanotechnology 12 1.13 Carbon Nanotubes and Structures 13 1.14 Molecular Logic Gates 14 1.15 Microdevices as Nanolevel Biosensors 15 1.16 Crosslinking in Co and Derivatisation 16 6 1.17 Fuel Cell 17 2 Principles of MEMS and MOEMS 19 2.1 Introduction 19 2.2 Driving Principle for actuation 20 2.3 Fabrication Process 21 2.4 Mechanical MEMS 23 2.4.1 Mechanical Sensor 23 2.4.2 Accelerometer, Cantilever and Capacitive Measurement 24 2.4.3 Microphone 25 2.4.4 Gyroscope 26 2.4.5 Mechanical Actuator 26 2.5 Thermal MEMS 28 2.5.1 Thermometry 28 2.5.2 Data Storage Applications 30XII 2.5.3 Microplate Gas Sensor 30 2.5.4 Thermoactuator 31 2.6 Magnetic MEMS 31 2.7 MOEMS 35 2.8 Spatial Light Modulator 37 2.9 Digital Micromirror Device 38 2.10 Grating Light Valve™ (GLV) 40 3. Laser Technology in Micromanufacturing 45 3.1. Introduction 45 3.2. Generation of Laser Light 45 3.3 Properties of Laser Light 49 3.3.1 Monochromacity 50 3.3.2 Directionality 50 3.3.3 Brightness 51 3.3.4 Coherence 51 3.3.5 Spatial Profile 51 3.3.6 Temporal Profile 52 3.4 Practical Lasers 52 3.5 Laser Technology in Micromanufacturing 54 3.5.1 Background 54 3.5.2 Absorption and Reflection of Laser Light 54 3.5.3 Application Technology Fundamentals 56 4 Soft Geometrical Error Compensation Methods Using Laser Interferometer. 63 4.1 Introduction 63 4.2 Overview of Geometrical Error Calibration 64 4.2.1 Error Measurement System 66 4.2.2 Accuracy Assessment 67 4.3 Geometrical Error Compensation Schemes 68 4.3.1 Look-up Table for Geometrical Errors 69 4.3.2 Parametric Model for Geometrical Errors 70 4.4 Experimental Results 73 4.4.1 Error Approximations 74 4.4.2 Linear Error 74 4.4.3 Straightness Error 77 4.4.4 Angular Error 77 4.4.5 Squareness Error 78 4.4.6 Assessment 79 4.5 Conclusions 79 5 Characterising Etching Process in Bulk Micromachining 83 5.1 Introduction 83 5.2 Wet Bulk Micromachining (WBM) 83 5.3 Review 84 5.4 Crystallography and Its Effects 85 5.4.1 An Example 86Contents XIII 5.5 Silicon as Substrate and Structural Material 87 5.5.1 Silicon as Substrate 87 5.5.2 Silicon as Structural Material 88 5.5.3 Stress and Strain 88 5.5.4 Thermal Properties of Silicon 92 5.6 Wet Etching Process 92 5.6.1 Isotropic Etchants 93 5.6.2 Reaction Phenomenon 93 5.6.3 Isotropic Etch Curves 94 5.6.4 Masking 96 5.6.5 DD Etchant 97 5.7 Anisotropic Etching 97 5.7.1 Anisotropic Etchants 98 5.7.2 Masking for Anisotropic Etchants 98 5.8 Etching Control: The Stop Techniques 99 5.8.1 Boron Diffusion Etch Stop 99 5.8.2 Electrochemical Etching Stop 100 5.8.3 Thin Films and SOI Etch Stop 101 5.9 Problems with Etching in Bulk Micromachining 102 5.9.1 RE Consumption 102 5.9.2 Corner Compensation 103 5.10 Conclusions 104 6 Features of Surface Micromachining and Wafer Bonding Process 107 6.1 Introduction 107 6.2 Photolithography 108 6.3 Surface Micromachining 1ll 6.3.1 Bulk versus Surface Micromachining 112 6.4 Characterising Surface Micromachining Process 113 6.4.1 Isolation Layer 113 6.4.2 Sacrificial Layer 114 6.4.3 Structural Material 114 6.4.4 Selective Etching 115 6.5 Properties 116 6.5.1 Adhesion 117 6.5.2 Stress 118 6.5.3 Stiction 121 6.6 Wafer Bonding 122 6.6.1 Anodic Bonding 123 6.6.2 Fusion Bonding 124 6.7 Summary 125 7 Micromanufacturing for Document Security: Optically Variable Device.

Von Händler/Antiquariat, Petra Gros Versandantiquariat, 56068 Koblenz.
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Lieferung aus: Deutschland, zzgl. Versandkosten.
Von Händler/Antiquariat, Petra Gros, 56068 Koblenz.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen

Lieferung aus: Deutschland, più spese di spedizione.
Von Händler/Antiquariat, Petra Gros, 56070 Koblenz.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen