Von dem Buch Reliability and Failure of Electronic Materials and Devices haben wir 6 gleiche oder sehr ähnliche Ausgaben identifiziert!
Falls Sie nur an einem bestimmten Exempar interessiert sind, können Sie aus der folgenden Liste jenes wählen, an dem Sie interessiert sind:
100%: Ohring, Milton: Reliability and Failure of Electronic Materials and Devices (ISBN: 9781493301737) 1998, Academic Press, Erstausgabe, in Englisch, Taschenbuch.Nur diese Ausgabe anzeigen…
100%: Milton Ohring, Lucian Kasprzak: Reliability and Failure of Electronic Materials and Devices (ISBN: 9780080516073) 1998, in Englisch, auch als eBook.Nur diese Ausgabe anzeigen…
100%: Milton Ohring;Lucian Kasprzak: Reliability and Failure of Electronic Materials and Devices (ISBN: 9780080575520) 2014, in Englisch, auch als eBook.Nur diese Ausgabe anzeigen…
86%: Milton Ohring, James R Lloyd, Lucian Kasprzak: Reliability and Failure of Electronic Materials and Devices (Revised) (Paperback) (ISBN: 9780128100363) 2000, in Englisch, Taschenbuch.Nur diese Ausgabe anzeigen…
81%: Milton Ohring, Lucian Kasprzak: Reliability and Failure of Electronic Materials and Devices, by (ISBN: 9780125249850) 2009, in Englisch, Broschiert.Nur diese Ausgabe anzeigen…
72%: Milton Ohring: Reliability and Failure of Electronic Materials and Devices (ISBN: 9780120885749) in Englisch, Broschiert.Nur diese Ausgabe anzeigen…
Reliability and Failure of Electronic Materials and Devices
13 Angebote vergleichen
Bester Preis: € 116,90 (vom 28.08.2018)1
Symbolbild
Reliability and Failure of Electronic Materials and Devices (2000)
EN NW RPISBN: 9780128100363 bzw. 0128100362, in Englisch, Academic Press, neu, Nachdruck.
Von Händler/Antiquariat, PBShop [61989342], Secaucus, NJ, U.S.A.
New Book.Shipped from US within 10 to 14 business days.THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
New Book.Shipped from US within 10 to 14 business days.THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
2
Symbolbild
Reliability and Failure of Electronic Materials and Devices (2000)
EN NW RPISBN: 9780128100363 bzw. 0128100362, in Englisch, Academic Press, neu, Nachdruck.
Von Händler/Antiquariat, Books2Anywhere [190245], Fairford, GLOS, United Kingdom.
New Book. Delivered from our US warehouse in 10 to 14 business days. THIS BOOK IS PRINTED ON DEMAND.Established seller since 2000.
New Book. Delivered from our US warehouse in 10 to 14 business days. THIS BOOK IS PRINTED ON DEMAND.Established seller since 2000.
3
Reliability and Failure of Electronic Materials and Devices (1998)
EN NW EBISBN: 9780080516073 bzw. 0080516076, in Englisch, Academic Press, neu, E-Book.
Lieferung aus: Niederlande, Direct beschikbaar.
bol.com.
Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book introduces the reader to the widely dispersed reliability literature of microelectronic and electronic-optional devices. Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime d... Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book introduces the reader to the widely dispersed reliability literature of microelectronic and electronic-optional devices. Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying thread of the book concerns product defects - their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed. The reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices, acquire skills in the mathematical handling of reliability data, and better appreciate future technology trends and the reliability issues they raise. It discusses reliability and failure on both the chip and packaging levels and handles the role of defects in yield and reliability. It includes a tutorial chapter on the mathematics of reliability and focuses on electromigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage and the mechanical failure of packages, contacts, and solder joints. It considers defect detection methods and failure analysis techniques. Productinformatie:Soort: Met illustraties;Taal: Engels;Vertaald uit het: Engels;Formaat: ePub met kopieerbeveiliging (DRM) van Adobe;Bestandsgrootte: 31.14 MB;Kopieerrechten: Het kopiëren van (delen van) de pagina's is niet toegestaan ;Printrechten: Het printen van de pagina's is niet toegestaan;Voorleesfunctie: De voorleesfunctie is uitgeschakeld;Geschikt voor: Alle e-readers te koop bij bol.com (of compatible met Adobe DRM). Telefoons/tablets met Google Android (1.6 of hoger) voorzien van bol.com boekenbol app. PC en Mac met Adobe reader software;ISBN10: 0080516076;ISBN13: 9780080516073;Product breedte: 158 mm;Product hoogte: 48 mm;Product lengte: 236 mm; Engels | Ebook | 1998.
bol.com.
Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book introduces the reader to the widely dispersed reliability literature of microelectronic and electronic-optional devices. Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime d... Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book introduces the reader to the widely dispersed reliability literature of microelectronic and electronic-optional devices. Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying thread of the book concerns product defects - their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed. The reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices, acquire skills in the mathematical handling of reliability data, and better appreciate future technology trends and the reliability issues they raise. It discusses reliability and failure on both the chip and packaging levels and handles the role of defects in yield and reliability. It includes a tutorial chapter on the mathematics of reliability and focuses on electromigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage and the mechanical failure of packages, contacts, and solder joints. It considers defect detection methods and failure analysis techniques. Productinformatie:Soort: Met illustraties;Taal: Engels;Vertaald uit het: Engels;Formaat: ePub met kopieerbeveiliging (DRM) van Adobe;Bestandsgrootte: 31.14 MB;Kopieerrechten: Het kopiëren van (delen van) de pagina's is niet toegestaan ;Printrechten: Het printen van de pagina's is niet toegestaan;Voorleesfunctie: De voorleesfunctie is uitgeschakeld;Geschikt voor: Alle e-readers te koop bij bol.com (of compatible met Adobe DRM). Telefoons/tablets met Google Android (1.6 of hoger) voorzien van bol.com boekenbol app. PC en Mac met Adobe reader software;ISBN10: 0080516076;ISBN13: 9780080516073;Product breedte: 158 mm;Product hoogte: 48 mm;Product lengte: 236 mm; Engels | Ebook | 1998.
4
Symbolbild
Reliability and Failure of Electronic Materials and Devices (Revised) (Paperback)
EN PB NW RPISBN: 9780128100363 bzw. 0128100362, in Englisch, Academic Press, United States, Taschenbuch, neu, Nachdruck.
Lieferung aus: Vereinigtes Königreich Großbritannien und Nordirland, Versandkostenfrei.
Von Händler/Antiquariat, The Book Depository US [58762574], London, United Kingdom.
Language: English . Brand New Book ***** Print on Demand *****.
Von Händler/Antiquariat, The Book Depository US [58762574], London, United Kingdom.
Language: English . Brand New Book ***** Print on Demand *****.
5
Reliability and Failure of Electronic Materials and Devices (1998)
EN PB NW FEISBN: 9781493301737 bzw. 149330173X, in Englisch, Academic Press, Taschenbuch, neu, Erstausgabe.
Von Händler/Antiquariat, Revaluation Books [2134736], Exeter, United Kingdom.
1st edition. 692 pages. 9.00x6.00x1.61 inches. In Stock.
1st edition. 692 pages. 9.00x6.00x1.61 inches. In Stock.
6
Reliability and Failure of Electronic Materials and Devices (2014)
EN NW EBISBN: 9780080575520 bzw. 0080575528, in Englisch, Academic Press, neu, E-Book.
Lieferung aus: Niederlande, Direct beschikbaar.
bol.com.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
bol.com.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
7
Reliability and Failure of Electronic Materials and Devices
EN NWISBN: 9780080575520 bzw. 0080575528, in Englisch, Academic Press, neu.
Lieferung aus: Vereinigte Staaten von Amerika, Lagernd, zzgl. Versandkosten.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
8
Reliability and Failure of Electronic Materials and Devices (1998)
EN PB NW FEISBN: 9781493301737 bzw. 149330173X, in Englisch, 692 Seiten, Academic Press, Taschenbuch, neu, Erstausgabe.
Lieferung aus: Vereinigte Staaten von Amerika, Usually ships in 1-2 business days, Real shipping costs can differ.
Von Händler/Antiquariat, OPTO-books.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Von Händler/Antiquariat, OPTO-books.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
9
Reliability and Failure of Electronic Materials and Devices (1998)
EN PB US FEISBN: 9781493301737 bzw. 149330173X, in Englisch, 692 Seiten, Academic Press, Taschenbuch, gebraucht, Erstausgabe.
Lieferung aus: Vereinigte Staaten von Amerika, Usually ships in 1-2 business days, Real shipping costs can differ.
Von Händler/Antiquariat, Gagazet Media.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Von Händler/Antiquariat, Gagazet Media.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
10
Reliability and Failure of Electronic Materials and Devices
DE NW EBISBN: 9780080516073 bzw. 0080516076, in Deutsch, Pergamon; Pergamon Press, Vereinigte Staaten von Amerika, neu, E-Book.
Lieferung aus: Schweiz, zzgl. Versandkosten, Sofort per Download lieferbar.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Lade…