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100%: Ran Wang; Krishnendu Chakrabarty: Testing of Interposer-Based 2.5D Integrated Circuits (ISBN: 9783319854618) 2017, Springer International Publishing, in Deutsch, Taschenbuch.Nur diese Ausgabe anzeigen…
100%: Ran Wang: Testing of Interposer-Based 2.5D Integrated Circuits (ISBN: 9783319547138) 2017, Erstausgabe, in Englisch, Broschiert.Nur diese Ausgabe anzeigen…
100%: Krishnendu Chakrabarty, Ran Wang: Testing of Interposer-Based 2.5D Integrated Circuits (ISBN: 9783319547145) 2017, Erstausgabe, in Englisch, auch als eBook.Nur diese Ausgabe anzeigen…
Testing of Interposer-Based 2.5D Integrated Circuits
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Bester Preis: € 111,42 (vom 01.09.2018)1
Testing of Interposer-Based 2.5D Integrated Circuits
DE NW EB DLISBN: 9783319547145 bzw. 3319547143, in Deutsch, Springer Shop, neu, E-Book, elektronischer Download.
Lieferung aus: Schweiz, Lagernd, zzgl. Versandkosten.
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. eBook.
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. eBook.
2
Testing of Interposer-Based 2.5D Integrated Circuits (2017)
DE NWISBN: 9783319547138 bzw. 3319547135, in Deutsch, Springer-Verlag Gmbh Mrz 2017, neu.
Von Händler/Antiquariat, AHA-BUCH GmbH [51283250], Einbeck, Germany.
Neuware - This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. 182 pp. Englisch.
Neuware - This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. 182 pp. Englisch.
3
Testing of Interposer-Based 2.5D Integrated Circuits
DE HC NWISBN: 9783319547138 bzw. 3319547135, in Deutsch, Springer Shop, gebundenes Buch, neu.
Lieferung aus: Schweiz, Lagernd, zzgl. Versandkosten.
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. Hard cover.
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. Hard cover.
4
Testing of Interposer-Based 2.5D Integrated Circuits (2017)
DE NW EB DLISBN: 9783319547145 bzw. 3319547143, in Deutsch, Springer, Springer, Springer, neu, E-Book, elektronischer Download.
Lieferung aus: Deutschland, in-stock.
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.
5
Testing of Interposer-Based 2.5D Integrated Circuits
DE NWISBN: 9783319547138 bzw. 3319547135, in Deutsch, neu.
Lieferung aus: Vereinigtes Königreich Großbritannien und Nordirland, Lieferzeit: 11 Tage.
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.
6
Testing of Interposer-Based 2.5D Integrated Circuits
DE NW EB DLISBN: 9783319547145 bzw. 3319547143, in Deutsch, Springer International Publishing, neu, E-Book, elektronischer Download.
Lieferung aus: Deutschland, Versandkostenfrei.
Testing of Interposer-Based 2.5D Integrated Circuits: This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. Englisch, Ebook.
Testing of Interposer-Based 2.5D Integrated Circuits: This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. Englisch, Ebook.
7
Testing of Interposer-Based 2.5D Integrated Circuits
DE HC NWISBN: 9783319547138 bzw. 3319547135, in Deutsch, Springer-Verlag Gmbh, gebundenes Buch, neu.
Lieferung aus: Deutschland, Versandkostenfrei.
Testing of Interposer-Based 2.5D Integrated Circuits: This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. Englisch, Buch.
Testing of Interposer-Based 2.5D Integrated Circuits: This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. Englisch, Buch.
8
Testing of Interposer-Based 2.5D Integrated Circuits (2017)
EN HC US FEISBN: 9783319547138 bzw. 3319547135, in Englisch, 182 Seiten, Springer, gebundenes Buch, gebraucht, Erstausgabe.
Neu ab: $70.48 (19 Angebote)
Gebraucht ab: $84.79 (7 Angebote)
Zu den weiteren 26 Angeboten bei Amazon.com
Lieferung aus: Vereinigte Staaten von Amerika, Usually ships in 1-2 business days, tatsächliche Versandkosten können abweichen.
Von Händler/Antiquariat, PBShop UK.
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable., Hardcover, Ausgabe: 1st ed. 2017, Label: Springer, Springer, Produktgruppe: Book, Publiziert: 2017-03-21, Studio: Springer, Verkaufsrang: 7562982.
Von Händler/Antiquariat, PBShop UK.
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable., Hardcover, Ausgabe: 1st ed. 2017, Label: Springer, Springer, Produktgruppe: Book, Publiziert: 2017-03-21, Studio: Springer, Verkaufsrang: 7562982.
9
Testing of Interposer-Based 2.5D Integrated Circuits (2017)
DE NWISBN: 9783319547138 bzw. 3319547135, in Deutsch, 182 Seiten, Springer-Verlag GmbH, neu.
Lieferung aus: Deutschland, Versandkosten nach: Schweiz.
Von Händler/Antiquariat, Rhein-Team Lörrach, [3332481].
Neuware - This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. -, 23.06.2017, Buch, Neuware, 241x148x20 mm, 449g, 182, Internationaler Versand, offene Rechnung (Vorkasse vorbehalten), PayPal, Banküberweisung.
Von Händler/Antiquariat, Rhein-Team Lörrach, [3332481].
Neuware - This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. -, 23.06.2017, Buch, Neuware, 241x148x20 mm, 449g, 182, Internationaler Versand, offene Rechnung (Vorkasse vorbehalten), PayPal, Banküberweisung.
10
Testing of Interposer-Based 2.5D Integrated Circuits (2017)
EN NW FE EB DLISBN: 9783319547145 bzw. 3319547143, in Englisch, 182 Seiten, Springer, neu, Erstausgabe, E-Book, elektronischer Download.
Lieferung aus: Vereinigtes Königreich Großbritannien und Nordirland, E-Book zum Download, Versandkostenfrei.
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable., Kindle Edition, Ausgabe: 1st ed. 2017, Format: Kindle eBook, Label: Springer, Springer, Produktgruppe: eBooks, Publiziert: 2017-03-20, Freigegeben: 2017-03-20, Studio: Springer.
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable., Kindle Edition, Ausgabe: 1st ed. 2017, Format: Kindle eBook, Label: Springer, Springer, Produktgruppe: eBooks, Publiziert: 2017-03-20, Freigegeben: 2017-03-20, Studio: Springer.
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