Handbook of 3D Integration - 3D Process Technology V 3 by Hardcover Book
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Preise | 2014 | 2015 | 2016 | 2020 | 2022 |
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Schnitt | € 128,52 | € 139,67 | € 149,08 | € 145,75 | € 136,66 |
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Handbook of 3D Integration
ISBN: 9783527334667 bzw. 3527334661, in Deutsch, Wiley-VCH, Weinheim, Deutschland, neu.
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers. von Garrou, Philip und Koyanagi, Mitsumasa und Ramm, Peter, Neu.
Handbook of 3D Integration
ISBN: 9783527334667 bzw. 3527334661, vermutlich in Englisch, Wiley VCH Verlag GmbH / Wiley-VCH, gebundenes Buch, neu.
Von Händler/Antiquariat, buecher.de GmbH & Co. KG, [1].
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers. 48 schwarz-weiße und 263 farbige Abbildungen Sofort lieferbar, Hardcover, Neuware, Offene Rechnung (Vorkasse vorbehalten).
Handbook of 3D Integration, Volume 3: 3D Process Technology (2014)
ISBN: 9783527334667 bzw. 3527334661, vermutlich in Englisch, Wiley-VCH Verlag GmbH, Weinheim, gebundenes Buch, neu.
Von Händler/Antiquariat, GreatBookPrices-, MD, Columbia, [RE:4].
100% Money Back Guarantee. Brand New, Perfect Condition. We offer expedited shipping to all US locations. Over 3, 000, 000 happy customers. Hard cover.
Handbook of 3d Integration: Volume 3-3d Process Technology: Vol 3 (2014)
ISBN: 9783527334667 bzw. 3527334661, Band: 3, vermutlich in Englisch, Vch Verlagsgesellschaft Mbh, gebundenes Buch, neu, Erstausgabe.
Von Händler/Antiquariat, Revaluation Books, DEVON, Exeter, [RE:3].
1st edition. 474 pages. 9.00x5.00x1.00 inches. Hardcover.
Handbook of 3D Integration, Volume 3: 3D Process Technology (2014)
ISBN: 9783527334667 bzw. 3527334661, vermutlich in Englisch, Wiley-VCH Verlag GmbH, Weinheim, gebundenes Buch, neu.
Von Händler/Antiquariat, GreatBookPricesLB2, MD, Columbia, [RE:5].
Hard cover.
Handbook of 3D Integration, Volume 3: 3D Process Technology (2014)
ISBN: 9783527334667 bzw. 3527334661, vermutlich in Englisch, Wiley-VCH Verlag GmbH, Weinheim, gebundenes Buch, neu.
Von Händler/Antiquariat, GreatBookPrices, MD, Columbia, [RE:4].
Hard cover.
Handbook of 3d Integration, Volume 3: 3d Process Technology (2014)
ISBN: 9783527334667 bzw. 3527334661, vermutlich in Englisch, Wiley-VCH Verlag GmbH, gebundenes Buch, neu.
Von Händler/Antiquariat, Palexbooks, NC, Sanford, [RE:3].
Hard cover.
Handbook of 3D Integration (2014)
ISBN: 9783527334667 bzw. 3527334661, Band: 155, vermutlich in Englisch, Wiley-VCH, gebundenes Buch, neu, Erstausgabe.
Volume 3: 3D Process Technology, Buch, Hardcover, 1. Auflage.