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100%: Wiley-VCH: Handbook of 3D Integration (ISBN: 9783527623068) 2011, in Englisch, Band: 1, Taschenbuch.Nur diese Ausgabe anzeigen…
77%: Herausgeber: Philip Garrou, Herausgeber: Christopher Bower, Herausgeber: Peter Ramm: Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits (ISBN: 9783527320349) 2008, Erstausgabe, in Englisch, Band: 2, Broschiert.Nur diese Ausgabe anzeigen…
69%: Editor: Philip Garrou, Editor: Christopher Bower, Editor: Peter Ramm: Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits (ISBN: 9783527623051) 2008, Wiley-VCH, Erstausgabe, in Englisch.
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Handbook of 3D Integration - 16 Angebote vergleichen
| Preise | 2016 | 2017 | 2018 | 2019 | 2020 |
|---|---|---|---|---|---|
| Schnitt | € 228,99 | € 224,11 | € 229,86 | € 225,81 | € 339,22 |
| Nachfrage |
1
Handbook of 3D Integration : Technology and Applications of 3D Integrated Circuits
DE HC USISBN: 9783527320349 bzw. 3527320342, in Deutsch, Wiley & Sons, Incorporated, John, gebundenes Buch, gebraucht.
Von Händler/Antiquariat, ThriftBooks [54239181], AURORA, IL, U.S.A.
A copy that has been read, but remains in clean condition. All pages are intact, and the cover is intact. The spine may show signs of wear. Pages can include limited notes and highlighting, and the copy can include previous owner inscriptions. At ThriftBooks, our motto is: Read More, Spend Less.
A copy that has been read, but remains in clean condition. All pages are intact, and the cover is intact. The spine may show signs of wear. Pages can include limited notes and highlighting, and the copy can include previous owner inscriptions. At ThriftBooks, our motto is: Read More, Spend Less.
2
Handbook of 3D Integration
~EN NW EB DLISBN: 9783527623068 bzw. 352762306X, vermutlich in Englisch, John Wiley & Sons Limited, neu, E-Book, elektronischer Download.
Lieferung aus: Russische Föderation, zzgl. Versandkosten.
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas. Наука, Образование/Техническая литература, book, PDF.
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas. Наука, Образование/Техническая литература, book, PDF.
3
Handbook of 3D Integration : Volume 1 - Technology and Applications of 3D Integrated Circuits
EN NW EB DLISBN: 9783527623068 bzw. 352762306X, Band: 1, in Englisch, Springer Berlin Heidelberg, neu, E-Book, elektronischer Download.
Lieferung aus: Vereinigtes Königreich Großbritannien und Nordirland, Despatched same working day before 3pm.
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
4
Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits
DEISBN: 9783527320349 bzw. 3527320342, in Deutsch, Wiley-VCH Verlag GmbH.
Lieferung aus: Vereinigte Staaten von Amerika, Lagernd.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
6
Handbook of 3D Integration
DE NWISBN: 9783527623068 bzw. 352762306X, in Deutsch, Wiley-VCH, Weinheim, Deutschland, neu.
Lieferung aus: Vereinigtes Königreich Großbritannien und Nordirland, Versandkostenfrei.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
7
Handbook of 3D Integration
~EN PB NW EB DLISBN: 9783527623068 bzw. 352762306X, vermutlich in Englisch, Wiley-VCH, Taschenbuch, neu, E-Book, elektronischer Download.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
9
Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits (2008)
EN HC US FEISBN: 9783527320349 bzw. 3527320342, in Englisch, 798 Seiten, Wiley-VCH Verlag GmbH & Co. KGaA, gebundenes Buch, gebraucht, Erstausgabe.
Lieferung aus: Deutschland, Versandfertig in 1 - 2 Werktagen, Versandkostenfrei. Tatsächliche Versandkosten können abweichen.
Von Händler/Antiquariat, betterworldbooks__.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Von Händler/Antiquariat, betterworldbooks__.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
10
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Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits (2 Vol. Set) (2008)
~EN HCISBN: 9783527320349 bzw. 3527320342, Band: 2, vermutlich in Englisch, Wiley-VCH, gebundenes Buch.
Lieferung aus: Vereinigte Staaten von Amerika, Versandkosten nach: DEU.
Von Händler/Antiquariat, Ergodebooks.
Wiley-VCH, 2008-10-21. 1. Hardcover. Used:Good.
Von Händler/Antiquariat, Ergodebooks.
Wiley-VCH, 2008-10-21. 1. Hardcover. Used:Good.
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