Handbook of 3D Integration (eBook, PDF) - 14 Angebote vergleichen

Lieferung aus: Schweiz, Sofort per Download lieferbar.
Volume 3: 3D Process Technology, Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers. PDF, 22.04.2014.

Lieferung aus: Deutschland, Sofort per Download lieferbar.
Volume 3: 3D Process Technology Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers. 22.04.2014, PDF.

Lieferung aus: Deutschland, Versandkostenfrei.
Handbook of 3D Integration: Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology.As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers. Englisch, Ebook.

Lieferung aus: Deutschland, E-Book zum Download, Versandkostenfrei.
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers. Kindle Ausgabe, Ausgabe: 1, Format: Kindle eBook, Label: Wiley-VCH, Wiley-VCH, Produktgruppe: eBooks, Publiziert: 2014-04-22, Freigegeben: 2014-04-22, Studio: Wiley-VCH.

Lieferung aus: Deutschland, E-Book zum Download.
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers. Kindle Edition, Ausgabe: 1, Format: Kindle eBook, Label: Wiley-VCH, Wiley-VCH, Produktgruppe: eBooks, Publiziert: 2014-04-22, Freigegeben: 2014-04-22, Studio: Wiley-VCH.

Lieferung aus: Deutschland, zzgl. Versandkosten.
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology.As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.

Lieferung aus: Vereinigtes Königreich Großbritannien und Nordirland, Despatched same working day before 3pm.
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.

Lieferung aus: Vereinigte Staaten von Amerika, E-Book zum Download.
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers. Kindle Edition, Ausgabe: 1, Format: Kindle eBook, Label: Wiley-VCH, Wiley-VCH, Produktgruppe: eBooks, Publiziert: 2014-04-22, Freigegeben: 2014-04-22, Studio: Wiley-VCH, Verkaufsrang: 1435843.

Lieferung aus: Vereinigte Staaten von Amerika, E-Book zum Download.
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers. Kindle Edition, Ausgabe: 1, Format: Kindle eBook, Label: Wiley-VCH, Wiley-VCH, Produktgruppe: eBooks, Publiziert: 2014-04-22, Freigegeben: 2014-04-22, Studio: Wiley-VCH, Verkaufsrang: 1615432.

Lieferung aus: Vereinigte Staaten von Amerika, E-Book zum Download.
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers. Kindle Edition, Ausgabe: 1, Format: Kindle eBook, Label: Wiley-VCH, Wiley-VCH, Produktgruppe: eBooks, Publiziert: 2014-04-22, Freigegeben: 2014-04-22, Studio: Wiley-VCH, Verkaufsrang: 1165232.