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Ultrasonic Distance Measurement Using Basys 3 FPGA Board100%: Kahraman, Ramazan: Ultrasonic Distance Measurement Using Basys 3 FPGA Board (ISBN: 9783961168422) 2019, diplom.de, N/A, in Englisch, Taschenbuch.
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Ultrasonic Distance Measurement Using Basys 3 FPGA Board (eBook, PDF)100%: Kahraman, Ramazan: Ultrasonic Distance Measurement Using Basys 3 FPGA Board (eBook, PDF) (ISBN: 9783961163427) Bedey Media GmbH, in Englisch, Taschenbuch.
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Ultrasonic Distance Measurement Using Basys 3 FPGA Board
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Bester Preis: 29,99 (vom 01.11.2019)
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9783961163427 - Kahraman, Ramazan: Ultrasonic Distance Measurement Using Basys 3 FPGA Board (eBook, PDF)
Kahraman, Ramazan

Ultrasonic Distance Measurement Using Basys 3 FPGA Board (eBook, PDF)

Lieferung erfolgt aus/von: Österreich ~EN NW

ISBN: 9783961163427 bzw. 3961163421, vermutlich in Englisch, Bedey Media GmbH, neu.

Lieferung aus: Österreich, Lieferzeit 1-2 Werktage, Versandkostenfrei innerhalb von Deutschland.
System-on-a-Chip (SoC) technology, which has evolved in recent years, is developed from different devices. A processor, several memory and peripheral components are located on a single chip to form today's high-performance SoCs with hundreds of IP blocks. IP cores are validated design blocks used as part of complex digital designs. Those designs are utilizing a hardware description language like VHDL or Verilog. In this way, time and cost of launching the product are reduced. Thanks to SoC, the features of computers were able to be reduced to the miniature level. Microcontrollers have the features of computer systems on a single chip. They are used to collect, process, and manipulate data in complex projects. The complexity of microcontrollers has increased to provide better performance and flexibility to meet customer requirements. However, it must be able to adapt to operational changes. The hardware of a microcontroller can not be changed afterward. If subsequent changes are nevertheless necessary, these are associated with high additional costs. Reconfigurable devices such as FPGAs can reconfigure the hardware to design, develop, and deploy high-performance digital systems. With the power of a SoC combined with the flexibility of an FPGA, the MC8051 IP Core proves to be a great alternative to purely microcontroller-based systems.
2
9783961168422 - Kahraman, Ramazan: Ultrasonic Distance Measurement Using Basys 3 FPGA Board
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Kahraman, Ramazan

Ultrasonic Distance Measurement Using Basys 3 FPGA Board

Lieferung erfolgt aus/von: Deutschland ~EN PB NW

ISBN: 9783961168422 bzw. 3961168423, vermutlich in Englisch, Diplom.de, Taschenbuch, neu.

Lieferung aus: Deutschland, Versandkosten nach: Deutschland, Versandkostenfrei.
Von Händler/Antiquariat, buecher.de GmbH & Co. KG, [1].
System-on-a-Chip (SoC) technology, which has evolved in recent years, is developed from different devices. A processor, several memory and peripheral components are located on a single chip to form today's high-performance SoCs with hundreds of IP blocks. IP cores are validated design blocks used as part of complex digital designs. Those designs are utilizing a hardware description language like VHDL or Verilog. In this way, time and cost of launching the product are reduced. Thanks to SoC, the features of computers were able to be reduced to the miniature level. Microcontrollers have the features of computer systems on a single chip. They are used to collect, process, and manipulate data in complex projects. The complexity of microcontrollers has increased to provide better performance and flexibility to meet customer requirements. However, it must be able to adapt to operational changes. The hardware of a microcontroller can not be changed afterward. If subsequent changes are nevertheless necessary, these are associated with high additional costs. Reconfigurable devices such as FPGAs can reconfigure the hardware to design, develop, and deploy high-performance digital systems. With the power of a SoC combined with the flexibility of an FPGA, the MC8051 IP Core proves to be a great alternative to purely microcontroller-based systems. Versandfertig in 6-10 Tagen, Softcover, Neuware, offene Rechnung (Vorkasse vorbehalten).
3
9783961163427 - Ramazan Kahraman: Ultrasonic Distance Measurement Using Basys 3 FPGA Board
Ramazan Kahraman

Ultrasonic Distance Measurement Using Basys 3 FPGA Board

Lieferung erfolgt aus/von: Deutschland ~EN PB NW EB DL

ISBN: 9783961163427 bzw. 3961163421, vermutlich in Englisch, Bedey Media GmbH, Taschenbuch, neu, E-Book, elektronischer Download.

19,99 + Versand: 7,50 = 27,49
unverbindlich
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
4
9783961168422 - Ramazan Kahraman: Ultrasonic Distance Measurement Using Basys 3 FPGA Board (Paperback)
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Ramazan Kahraman

Ultrasonic Distance Measurement Using Basys 3 FPGA Board (Paperback) (2019)

Lieferung erfolgt aus/von: Vereinigtes Königreich Großbritannien und Nordirland ~EN PB NW

ISBN: 9783961168422 bzw. 3961168423, vermutlich in Englisch, diplom.de, N/A, Taschenbuch, neu.

57,43 + Versand: 3,48 = 60,91
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Von Händler/Antiquariat, The Book Depository EURO [60485773], London, United Kingdom.
Language: English. Brand new Book.
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3961168423 - Ramazan Kahraman: Ultrasonic Distance Measurement Using Basys 3 FPGA Board
Ramazan Kahraman

Ultrasonic Distance Measurement Using Basys 3 FPGA Board

Lieferung erfolgt aus/von: Deutschland ~EN PB NW

ISBN: 3961168423 bzw. 9783961168422, vermutlich in Englisch, Diplom.de, Taschenbuch, neu.

29,99 + Versand: 7,50 = 37,49
unverbindlich
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
6
3961168423 - Ultrasonic Distance Measurement Using Basys 3 FPGA Board

Ultrasonic Distance Measurement Using Basys 3 FPGA Board

Lieferung erfolgt aus/von: Deutschland ~EN NW

ISBN: 3961168423 bzw. 9783961168422, vermutlich in Englisch, neu.

Ultrasonic Distance Measurement Using Basys 3 FPGA Board ab 29.99 EURO.
7
9783961168422 - Kahraman, Ramazan: Ultrasonic Distance Measurement Using Basys 3 FPGA Board
Kahraman, Ramazan

Ultrasonic Distance Measurement Using Basys 3 FPGA Board (2019)

Lieferung erfolgt aus/von: Deutschland EN PB NW

ISBN: 9783961168422 bzw. 3961168423, in Englisch, 60 Seiten, Diplom.de, Taschenbuch, neu.

Lieferung aus: Deutschland, Gewöhnlich versandfertig in 2 bis 3 Tagen. Versandkostenfrei. Tatsächliche Versandkosten können abweichen.
Von Händler/Antiquariat, Books on Demand GmbH.
Diplom.de, Taschenbuch, Publiziert: 2019-10-09T00:00:01Z, Produktgruppe: Book, Hersteller-Nr: 9783961168422.
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9783961168422 - Ultrasonic Distance Measurement Using Basys 3 FPGA Board
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Ultrasonic Distance Measurement Using Basys 3 FPGA Board

Lieferung erfolgt aus/von: Vereinigte Staaten von Amerika ~EN NW

ISBN: 9783961168422 bzw. 3961168423, vermutlich in Englisch, neu.

62,03 + Versand: 14,33 = 76,36
unverbindlich
Von Händler/Antiquariat, GreatBookPrices [5352716], Columbia, MD, U.S.A.
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